MTE710T

Transcend's MTE710T M.2 SSD uses the PCI Express (PCIe) Gen 4 x4 interface and supports NVM Express (NVMe) 1.4 specifications, achieving unprecedented transfer speeds. The MTE710T features next-generation 3D NAND technology, which enables the vertical stacking of 112 layers of 3D NAND Flash chips. Compared to 96-layer 3D NAND technology, this advance in density considerably improves storage efficiency, and its integrated DRAM cache enables faster access. Equipped with Corner Bond technology and 30 µ" PCB connectors, the MTE710T has undergone extensive internal testing to ensure reliability in key applications, and boasts a durability rating of 3000 data write/wipe cycles, as well as an extended operating temperature ranging from -20℃ to 75 ℃.

112-layer 3D NAND Flash

PCB has gold-plated connection pins with a thickness of 30µ

Corner Bond

Extended Temperature

Dynamic Speed Limit Adjustment

Change in Reading Data

Garbage collection

Wear leveling

TRIM

Defective block management

Early Move

Features

FIRMWARE FEATURES

  • Supports NVM commands
  • SLC caching technology
  • Dynamic thermal throttling
  • Integrated LDPC ECC (Error Correction Code) function
  • Advanced global wear leveling and defective block management for reliability
  • Advanced Waste Collection
  • Enhanced S.M.A.R.T. function for durability
  • TRIM command for better performance
  • Full disk encryption with Advanced Encryption Standard (AES) (optional)

HARDWARE FEATURES

  • Complies with RoHS standards
  • Complies with PCI Express 3.1 specifications
  • Complies with NVM Express 1.4 specifications
  • M.2 form factor (80mm) - ideal for mobile computing devices
  • PCIe Gen 4 x 4 interface
  • Integrated DDR4 cache module
  • Resistance: 3K P/E (Program/Erase) cycles guaranteed
  • The main components are factory reinforced with Corner Bond technology
  • PCB has gold-plated connection pins with a thickness of 30µ
  • Promised operational reliability over a wide temperature range (from -20 °C to 75 °C)
  • Supports Transcend's Scope Pro software

SPECIFICATIONS

APPEARANCE
DIMENSIONS 80 mm x 22 mm x 3.58 mm (3.15″ x 0.87″ x 0.14″)
WEIGHT 10 g (0.35 oz)
FORM FACTOR M.2
TYPE M.2 2280-D2-M (Double-sided)

INTERFACE
BUS INTERFACE NVMe PCIe Gen4 x4

STORAGE
FLASH TYPE 3D NAND Flash
CAPACITY 256 GB/

512 GB/

1 TB/

2 TB

OPERATING ENVIRONMENT
OPERATING VOLTAGE 3.3V±5%
OPERATING TEMPERATURE Extended

-20°C (-4°F) ~ 75°C (167°F)
STORAGE TEMPERATURE -55°C (-67°F) ~ 85°C (185°F)
HUMIDITY 5% ~ 95%
SHOCK 1500 G, 0.5 ms, 3-axis
VIBRATION (WORKING) 20 G (Peak-to-Peak), 7 Hz ~ 2000 Hz (frequency)

FOOD
ENERGY CONSUMPTION (OPERATING) 4.9 Watt(s)
POWER CONSUMPTION (IDLE) 1.52 Watt(s)

PERFORMANCE
SEQUENTIAL READING / WRITING (CRYSTALDISKMARK) Reading: Up to 3,800 MB/s
Write: Up to 3,200 MB/s
RANDOM READ / WRITE 4K (IOMETER) Reading: Up to 500,000 IOPS
Writing: Up to 560,000 IOPS
MEAN TIME BETWEEN FAILURES (MTBF) 5,500,000 hour(s)
TERABYTES WRITTEN (TBW) Up to 1,700 TBW
NUMBER OF DISKS WRITTEN PER DAY (DWPD) 1.55 (3 years)
NOTE - Speed may vary due to host, hardware, software, usage and storage capacity.

- The workload used to qualify the DWPD may be different compared to your actual workload, due to differences in host hardware, software, usage and storage capacity.

- Terabytes Written (TBW) indicates endurance under the highest capacity.

 

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